By R.E. Vears
By Dennis Roddy, John G. Coolen
By S A Knight
By Steve Winder (European Field Applications Engineer for Intersil Inc., California, USA)
By Ravender Goyal (Mentor Graphics Corporation, Wilsonville, Oregon)
By John G. Proakis, Dimitris K Manolakis
By William E. Sabin
By Emmanuel Ifeachor, Barrie Jervis
By John D. Martin
By S. C. Bloch
By Hwei Hsu
By Monson Hayes
By Robert Alexander
By Gordon J. Deboo, Clifford Burrows
By Vinay Ingle, John G. Proakis
By Stewart Brand
By Norman L. Biggs
By Andreas E. Kyprianou
By Erran Carmel (American University, Washington DC), Paul Tjia
By Kyle MacRae
By Mike Tooley (Formerly Vice Principal, Dean of Faculty and Head of Engineering at Brooklands College, Surrey, UK)
By F.G. Stremler
By S.S. Haykin
By Paul Lorrain, Dale R. Corson
By Colin A. Jones
By Barbara Smith, Linda Field
By Roger L. Tokheim
By Gerard Maral, M. Bousquet
By Philip Burnard, Paul Gill (University College London, UK)