By Keith Brindley
By Michael H. Tooley
By Rex Miller, Fred W. Culpepper
By John O. Bird
By The Editors of Rea, Gu
By D Tyler
By Stuart Ball
By O.N. Bishop
By J.W. Bignell, R. P. Donovan
By Myke Predko
By Natalie Lunis
By R. F. W. Coates
By Paul Lorrain, Dale R. Corson
By Daniel Fleisch (Wittenberg University, Ohio)
By Brian Holdsworth, Clive Woods (FIET Associate Dean, College of Engineering Professor of Electrical Engineering University of South Alabama)
By Gerard Maral, M. Bousquet
By John G. Proakis
By Constantine A. Balanis
By David Dugdale
By John Bird (Defence College of Technical Training, UK)
By Timothy J. Jorgensen
By Brian Clegg
By M.E.Van Valkenburg, Rolf Schaumann, Rolf Schaumann (Professor, Head Department of Electrical Engineering, Portland State University, USA)
By T. H. Wilmshurst (Formerly of the Department of Electronics and Computer Science, university of Southampton, UK)
By Brian DeMuth (US Department of Defense), Dan Eisenreich (US Department of Defense)
By Ravender Goyal (Mentor Graphics Corporation, Wilsonville, Oregon)
By Tony Fischer-Cripps (Commonwealth Scientific & Industrial Research Organisation, Australia)
By Stuart Ball (Embedded Systems consultant and author)